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MicroCube

MicroCube thermal core image 1

MicroCube thermal camera

Ultra-compact thermal camera: MicroCube, the smallest ITAR-free VGA uncooled LWIR camera core. With remarkably small size and low consumption, it sets a new standard in European offering of 12 µm pixel thermal cameras for SWaP optimized applications.

MicroCube thermal camera features
VGA 12 µm pixel pitch thermal core
Very compact design
Shutterless
Ultra efficient power consumption

Description

MicroCube is the latest generation of 12 µm thermal cores, engineered in a compact SWaP design with standard interfaces for seamless integration. European-made and measuring just 22 x 22 mm, it combines ultra-low weight and power consumption with high performance, delivering NETD < 40 mK sensitivity. This makes it an exceptional choice for UAVs, UGVs, robotic platforms, handheld devices, and any battery-powered system where space, efficiency, and reliability are critical.

NEW: MicroCube XP Series – Ultra-SWaP thermal core with extreme sensitivity. The MicroCube XP delivers unmatched performance in a compact, ultra-SWaP design optimized for defense, drone, and embedded applications. Featuring NETD < 20 mK with denoising for superior thermal sensitivity, shutterless operation with < 0.7 s startup for rapid deployment, and contour enhancement technology for exceptional contrast, DRI, and target visibility. A built-in contour sharpness score enables precise autofocus management, while versatile interfaces ensure seamless integration into advanced platforms.

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Detailed datasheets, brochures and other reference materials are available upon request.

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Technical Information

Camera Specifications MicroCube XP 640 MicroCube 640
Pixel pitch 12 µm 12 µm
Image format 640 x 480 pixels 640 x 480 pixels
Spectral range 8 - 14 µm 8 - 14 µm
Max frame rate 60 Hz 60 Hz
Operating temperature range -40°C to +70°C -40°C to +70°C
Power consumption < 1.2 W < 1.2 W
Qualification MIL-STD-810G - Method 514 Vibration:
10Hz - 2kHz 13.95g per axis 10h per axis 		Industrial (Standard grade)
Max NETD (F/1; 300K; 30 Hz) < 20 mK with denoising < 50 mK or < 40 mK
Output options MIPI-CSI, DF40, UVC MIPI-CSI, DF40, UVC

Features

  • The most compact uncooled thermal core
  • Latest generation 12 µm pixel technology
  • Easy integration into multiple platform types
  • Ultra-efficient power consumption

Options

MicroCube XP 640 thermal core

The MicroCube XP (Extreme Performance) 640 offers a 640 x 480 resolution with a 12 µm pixel pitch and exceptional thermal sensitivity (NETD < 20 mK with denoising), all in an ultra-compact form factor. Thanks to its fast startup (<0.7 s), shutterless operation, and enhanced thermal stability, it delivers fast and reliable performance for defense and critical applications.

Ultra-SWaP thermal core
Advanced shutterless imaging with integrated correction
Edge enhancement: refined DRI and optimized object clarity
Spatial and temporal noise reduction: NETD halved, from 40 mK to 20 mK
Core optimized for sharp contrast and precise autofocus management
MicroCube 640 thermal core

MicroCube 640 is the latest generation of thermal cores in 12 µm pixel pitch, featuring true SWaP design and covering main standard interfaces. It is suitable for applications where consumption and/or footprint are key factors, namely UAVs, UGVs, and robot-type platforms, as well as handheld devices and all battery-powered equipment.

Brochure/Leaflet

MicroCube 640 MicroCube XP 640 (NEW)
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