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LWIR – LongWave

Our LWIR camera cores are ideal for surveillance, homeland security, object detection, industrial and scientific applications.

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Dione

Dione thermal camera front view

Dione thermal camera

Compact thermal camera: The Dione series consists of SWaP (Size, Weight and Power) optimized cores that exhibit extremely small form factor and low weight. The cores come in four image resolution versions: 320 x 240 (QVGA), 640 x 480 (VGA), 1024 x 768 (XGA) and 1280 x 1024 (SXGA). All versions are based on a state-of-the-art microbolometer detectors with 12 µm pixel pitch and has NETD less than 50 mK (< 40 mK, available upon request).

Dione thermal camera spectral overview

Description

The Dione products are available with shutter and without shutter options. In the latter case, an advanced shutterless image correction algorithm ensures optimal image quality. Dione products (except OEMs) come with a variety of lens options and optical mounts (optional). The Dione products are ideally suited for integration in security and defence systems, either vehicle-mounted or on aerial platforms. Key features include a low-latency image transfer and short time-to-image after startup.The Dione outputs data via a 16 bit Digital Video interface, MIPI-CSI2, UVC (USB Video Class).

The Dione XP/XP S series features SWaP (Size, Weight, and Power) optimized cores with an ultra-compact form factor and minimal weight. It integrates advanced imaging capabilities with OEM (shutterless) and CAM versions (shuttered and shutterless). This series is an enhanced iteration of the Dione series, equipped with a 640 x 480 microbolometer sensor at 12μm pixel pitch, offering a NETD of 35 mK (available upon request) or 40 mK. Camera versions are compatible with M24 and M34 lens mounts. The XP series delivers exceptional dynamic range and sharp image contrast. It also offers ultra-fast startup, expanded operating temperature ranges, enhanced IETD correction, and auto-switch functionality

Firmware Options

Powered by cutting-edge XLIE algorithms, the Dione XP offers two firmware options to meet diverse operational needs

  • Performance Mode - Optimized for maximum image quality and processing speed
  • Contour Detection Mode - Specialized for precise edge and shape recognition

Designed for demanding defense and industrial applications, the Dione XP series ensures top-tier performance in rigorous environments.

Request Documentation

Detailed datasheets, brochures and other reference materials are available upon request.

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Technical Information

Camera Specifications Dione 320 OEM Dione 640 OEM Dione 1024 OEM Dione 1280 OEM Dione 320 CAM
Pixel pitch 12 µm 12 µm 12 µm 12 µm 12 µm
Image format 320 x 240 pixels 640 x 480 pixels 1024 x 786 pixels 1280 x 1024 pixels 320 x 240 pixels
Spectral range 8 - 14 µm 8 - 14 µm 8 - 14 µm 8 - 14 µm 8 - 14 µm
Max frame rate (full frame) 60 Hz 60 Hz 80 Hz 60 Hz (16bit DV, MIPI CSI-2); 40 Hz (USB) 60 Hz
Regulatory compliance RoHS RoHS RoHS RoHS RoHS
Integration type Rolling shutter Rolling shutter Rolling shutter Rolling shutter Rolling shutter
Average power consumption 570 mW (16bit DV) 0.750 W (16bit DV);
< 1.1 W (MIPI CSI-2);
< 1.32 W (UVC);
< 1.3 W (USB)		 2.1 W 2.1 W (16bit DV);
< 2.7 W (MIPI CSI-2, USB)		 570 mW
Detector NETD < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);
Digital output format 16 bit DV,
MIPI CSI-2		 16 bit DV,
MIPI CSI-2,
USB,
UVC		 16 bit DV,
MIPI CSI-2		 16 bit DV, MIPI CSI-2, USB 16 bit DV,
MIPI CSI-2
Camera Specifications Dione 640 CAM Dione 1024 CAM Dione 1280 CAM Dione S 640 CAM Dione S 1024 CAM
Pixel pitch 12 µm 12 µm 12 µm 12 µm 12 µm
Image format 640 x 480 pixels 1024 x 786 pixels 1280 x 1024 pixels 640 x 480 pixels 1024 x 786 pixels
Spectral range 8 - 14 µm 8 - 14 µm 8 - 14 µm 8 - 14 µm 8 - 14 µm
Max frame rate (full frame) 60 Hz 80 Hz 60 Hz (16bit DV, MIPI CSI-2); 40 Hz (USB) 60 Hz 80 Hz
Regulatory compliance RoHS RoHS RoHS RoHS RoHS
Integration type Rolling shutter Rolling shutter Rolling shutter Rolling shutter Rolling shutter
Power consumption 0.750 W (16bit DV);
< 1.1 W (MIPI CSI-2);
<1.32 W (UVC);
< 1.3 W (USB)		 2.1 W 2.1 W
(16bit DV);
< 2.7 W (MIPI CSI-2, USB)		 0.800 W (16bitDV);
< 1.3 W W(USB);
<1.0 W (MIPI CSI-2)		 2.3 W
Optical interface (optional) M24 or M34 x0.5 M34x0.5 or M45x0.75 M34x0.5 or M45x0.75 M24 or M34 x0.5 M34x0.5 or M45x0.75
Detector NETD < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);		 < 50 mK;
<40 mK (available upon request);
Digital output format 16 bit DV, MIPI CSI-2, USB, UVC 16bit DV 16 bit DV, MIPI CSI-2, USB 16 bit DV, MIPI CSI-2, USB 16bit DV
Camera Specifications Dione S 1280 CAM Dione XP 640 OEM Dione XP 640 CAM Dione XP S 640 CAM
Pixel pitch 12 µm 12 µm 12 µm 12 µm
Image format 1280 x 1024 pixels 640 x 480 pixels 640 x 480 pixels 640 x 480 pixels
Spectral range 8 - 14 µm 8 - 14 µm 8 - 14 µm 8 - 14 µm
Max frame rate (full frame) 60 Hz (16bit DV, MIPI CSI-2); 40 Hz (USB) 60 Hz 60 Hz 60 Hz
Regulatory compliance RoHS RoHS RoHS RoHS
Integration type Rolling shutter Rolling shutter Rolling shutter Rolling shutter
Power consumption 2.3 W (16bitDV);
<2.6 W (MIPI CSI-2);
<2.7 W (USB)		 0.750 W (16bit DV); < 1.1 W (MIPI CSI-2); <1.32 W (UVC); < 1.3 W (USB) 0.750 W (16bit DV); < 1.1 W (MIPI CSI-2); <1.32 W (UVC); < 1.3 W (USB) 0.800 W (16bitDV);
< 1.3 W (USB);
<1.0 W (MIPI CSI-2)
Optical interface (optional) M34x0.5 or M45x0.75 M24 or M34 x0.5 M24 or M34 x0.5 M24 or M34 x0.5
Detector NETD < 50 mK;
<40 mK (available upon request);		 < 40 mK;
<35 mK		 < 40 mK;
<35 mK		 < 40 mK;
<35 mK
Digital output format 16 bit DV, MIPI CSI-2, USB 16 bit DV, MIPI CSI-2, USB, UVC 16 bit DV, MIPI CSI-2, USB, UVC 16 bit DV, MIPI CSI-2, USB

Options

Dione 320 OEM series thermal core

The Dione 320 OEM series is based on a state-of-the-art detector with a 320x240 pixels and 12 µm pixel pitch. The detector NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz. Dione 320 OEM versions benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and availability of multiple lenses adds flexibility for integration programs in the target markets such as industrial machine vision, medical, scientific and advanced research, safety and security applications.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power)
  • Frame rates up to 60 Hz
Specifications
Mechanical specifications
Mechanical specifications Dione 320 OEM 40 mK Dione 320 OEM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 25 x 25 x 10 25 x 25 x 10
Weight [gr] - excluding lens 6 6
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR SAMTEC ST5-30-1.50-L-D-P-TR
Environmental & Power specifications
Environmental & Power specifications Dione 320 OEM 40 mK Dione 320 OEM 50 mK
Ambient operating temperature range [°C] From -40 to +70 From -40 to +70
Storage temperature [°C] From -45 to +85 From -45 to +85
Power consumption 570 mWatt (at 60 Hz operation; 16bit DV) 570 mWatt (at 60 Hz operation; 16bit DV)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 320 OEM 40 mK Dione 320 OEM 50 mK
Image format [pixels] 320 x 240 320 x 240
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 3.84 x 2.88 [diagonal 4.8] 3.84 x 2.88 [diagonal 4.8]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 60 Hz, 300K, F/1], available upon request <50 [at 60 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8-14
Pixel operability >99.8% >99.8%
Max frame rate [full frame] [Hz] 60 60
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control SAMTEC ST5 connector SAMTEC ST5 connector
Digital output format 16bit DV (standard), MIPI CSI-2 (optional) 16bit DV (standard), MIPI CSI-2 (optional)
Trigger SAMTEC ST5 connector SAMTEC ST5 connector
Dione 320 CAM series thermal core

The Dione 320 CAM series is based on the Dione 320 OEM thermal imaging core with 320x240 pixels and 12 µm pixel pitch. The detector NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz. Dione 320 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M24/M34 lens (optional). Dione 320 CAM benefits from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and availability of multiple lens provides high level of tunability for optimal integration into many systems.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Shutterless and uncooled operation
Specifications
Mechanical specifications
Mechanical specifications Dione 320 CAM 40 mK Dione 320 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 31 x 31 x 22* or 40 x 40 x 24* 31 x 31 x 22* or 40 x 40 x 24*
Weight [gr] - excluding lens 27* or 30* 27* or 30*
Optical interface (optional) M24 or M34 x0.5 M24 or M34 x0.5
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR SAMTEC ST5-30-1.50-L-D-P-TR

* refers to specifications applicable for optical interfaces (optional)

Environmental & Power specifications
Environmental & Power specifications Dione 320 CAM 40 mK Dione 320 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 From -40 to +70
Storage temperature [°C] From -45 to +85 From -45 to +85
Power consumption [mWatt] 570 mWatt (at 60 Hz operation; 16bit DV) 570 mWatt (at 60 Hz operation; 16bit DV)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 320 CAM 40 mK Dione 320 CAM 50 mK
Image format [pixels] 320 x 240 320 x 240
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 3.84 x 2.88 [diagonal 4.8] 3.84 x 2.88 [diagonal 4.8]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 60 Hz, 300K, F/1], available upon request <50 [at 60 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8 - 14
Pixel operability >99.8% >99.8%
Max frame rate [full frame] [Hz] 60 60
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control SAMTEC ST5 connector SAMTEC ST5 connector
Digital output format 16bit DV (standard)

MIPI CSI-2 (optional)		 16bit DV (standard)

MIPI CSI-2 (optional)
Trigger SAMTEC ST5 connector SAMTEC ST5 connector
Dione 640 OEM series thermal core

The Dione 640 OEM series is based on an uncooled microbolometer detector with a 640x480 pixel resolution and 12 µm pixel pitch. The detector NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz. The Dione 640 OEM benefits from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and availability of multiple lenses adds flexibility for integration programs in the target markets like safety and security, transportation and industrial process monitoring.

  • State-of-the-art detector with 12 µm pixel pitch
  • Industry leading SWaP (Size, Weight and Power)
  • Frame rates up to 60 Hz
Specifications
Mechanical specifications
Mechanical specifications Dione 640 OEM 40 mK Dione 640 OEM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 25 x 25 x 10 (16bit DV); 25 x 25 x 16.5 (MIPI CSI-2); 25 x 25 x 16 (UVC); 25 x 25 x 18 (USB) 25 x 25 x 10 (16bit DV); 25 x 25 x 16.5 (MIPI CSI-2); 25 x 25 x 16 (UVC); 25 x 25 x 18 (USB)
Weight [gr] 6 (16bitDV); 9 (MIPI CSI-2); 10 (USB, UVC) 6 (16bitDV); 9 (MIPI CSI-2); 10 (USB, UVC)
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV]; 22-pin FFC/FPC connector (Molex) [MIPI CSI-2]; 80-pin Hirose DF40C-80DP-0.4V (51) [UVC]; Type B USB 3.0 [USB] SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV]; 22-pin FFC/FPC connector (Molex) [MIPI CSI-2]; 80-pin Hirose DF40C-80DP-0.4V(51) [UVC]; Type B USB 3.0 [USB]
Environmental & Power specifications
Environmental & Power specifications Dione 640 OEM 40 mK Dione 640 OEM 50 mK
Ambient operating temperature range [°C] From -40 to +70 (16bit DV, UVC and USB); From -30 to +70 (MIPI CSI-2) From -40 to +70 (16bit DV, UVC and USB); From -30 to +70 (MIPI CSI-2)
Storage temperature [°C] From -45 to +85(16bit DV, UVC); From -40 to +85 (USB); From -30 to +85 (MIPI CSI-2) From -45 to +85(16bit DV, UVC); From -40 to +85 (USB); From -30 to +85 (MIPI CSI-2)
Power consumption [W] 0.750 (60 Hz operation; 16bit DV); < 1.1 (MIPI CSI-2); < 1.32 (UVC); < 1.3 (USB) 0.750 (60 Hz operation; 16bit DV); < 1.1 (MIPI CSI-2); < 1.32 (UVC); < 1.3 (USB)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 640 OEM 40 mK Dione 640 OEM 50 mK
Image format [pixels] 640 x 480 640 x 480
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 7.68 x 5.76 [9.6 diagonal] 7.68 x 5.76 [9.6 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8 - 14
Pixel operability >99.5% (excluding 3 peripheral rows and columns) >99.5% (excluding 3 peripheral rows and columns)
Max frame rate [full frame] [Hz] 60 60
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control via SAMTEC ST5 connector [16bit DV]; I2C (or via SAMTEC ST5 connector on Dione 640) [MIPI CSI-2]; GenCP protocol over COM port [UVC]; GenCP over virtual COM port enumerated over the USB interface [USB] via SAMTEC ST5 connector [16bit DV]; I2C (or via SAMTEC ST5 connector on Dione 640) [MIPI CSI-2]; GenCP protocol over COM port [UVC]; GenCP over virtual COM port enumerated over the USB interface [USB]
Digital output format 16bit DV, MIPI-CSI-2, UVC, USB 16bit DV, MIPI-CSI-2, UVC; USB
Trigger via SAMTEC ST5 connector (16bit DV); NA (UVC, USB, MIPI CSI-2) via SAMTEC ST5 connector (16bit DV); NA (UVC, USB, MIPI CSI-2)
Dione 640 CAM series thermal core

Based on an uncooled microbolometer detector (Dione 640 OEM), the Dione 640 CAM series is offered with 640x480 pixel resolution and 12 µm pixel pitch. With detector NETD of less than 40 mK (based on request) or 50 mK, and maximum frame rate of 60 Hz, Dione 640 CAM series is a LWIR uncooled thermal imaging core with SWaP features.

Dione 640 CAM series is available with housing supporting M24/M34 lens options. Xenics image enhancement is utilized for the camera series to offer advanced image processing while keeping power consumption low. The availability of multiple lens options and GenICam compliance provides flexibility and makes the Dione 640 CAM series to be suitable for a range of markets like defense, transportation and industrial process monitoring.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Shutterless and uncooled operation
Specifications
Mechanical specifications
Mechanical specifications Dione 640 CAM 40 mK Dione 640 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 31 x 31 x 22 (M24 - 16bit DV); 40 x 40 x 24 (M34 - 16bit DV);
31 x 31 x 30 (M24 - MIPI CSI-2); 40 x 40 x 32 (M34 - MIPI CSI-2);
31 x 31 x 29 (M24 - UVC); 40 x 40 x 31 (M34 - UVC);
31 x 31 x 35.25 (M24 - USB); 40 x 40 x 37.25 (M34 - USB)		 32 x 31 x 22 (M24 - 16bit DV); 40 x 40 x 24 (M34 - 16bit DV);
31 x 31 x 30 (M24 - MIPI CSI-2); 40 x 40 x 32 (M34 - MIPI CSI-2);
31 x 31 x 29 (M24 - UVC); 40 x 40 x 31 (M34 - UVC);
31 x 31 x 35.25 (M24 - USB); 40 x 40 x 37.25 (M34 - USB)
Weight [gr] - excluding lens 27 (M24 - 16bit DV); 30 (M34 - 16bit DV);
37 (M24 - MIPI CSI-2, USB); 40 (M34- MIPI CSI-2);
36 (M24 - UVC); 39 (M34 - UVC); 42 (M34 -USB)		 28 (M24 - 16bit DV); 30 (M34 - 16bit DV);
37 (M24 - MIPI CSI-2, USB); 40 (M34- MIPI CSI-2);
36 (M24 - UVC); 39 (M34 - UVC); 42 (M34 -USB)
Optical interface M24 or M34 x 0.5 M24 or M34 x 0.5
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV]; 22-pin FFC/FPC connector (Molex) [MIPI CSI-2]; 80-pin Hirose DF40C-80DP-0.4V (51) [UVC]; Type B USB 3.0 [USB] SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV]; 22-pin FFC/FPC connector (Molex) [MIPI CSI-2]; 80-pin Hirose DF40C-80DP-0.4V (51) [UVC]; Type B USB 3.0 [USB]
Environmental & Power specifications
Environmental & Power specifications Dione 640 CAM 40 mK Dione 640 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 (16bit DV, UVC, USB);
From -30 to +70 (MIPI CSI-2)		 From -40 to +70 (16bit DV, UVC, USB);
From -30 to +70 (MIPI CSI-2)
Storage temperature [°C] From -45 to +85(16bit DV, UVC); From -40 to +85 (USB); From -30 to +85 (MIPI CSI-2) From -45 to +85(16bit DV, UVC); From -40 to +85 (USB); From -30 to +85 (MIPI CSI-2)
Power consumption [W] 0.750 (60 Hz operation; 16bit DV); < 1.1 (MIPI CSI-2); <1.32 (UVC); < 1.3 (USB) 0.750 (60 Hz operation; 16bit DV); < 1.1 (MIPI CSI-2); <1.32 (UVC); < 1.3 (USB)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 640 CAM 40 mK Dione 640 CAM 50 mK
Image format [pixels] 640 x 480 640 x 480
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 7.68 x 5.76 [9.6 diagonal] 7.68 x 5.76 [9.6 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8-14 8-14
Pixel operability >99.5% (excluding 3 peripheral rows and columns) >99.5% (excluding 3 peripheral rows and columns)
Max frame rate [full frame] [Hz] 60 60
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control via SAMTEC ST5 connector [16bit DV];
I2C (or via SAMTEC ST5 connector on Dione 640) [MIPI CSI-2];
GenCP protocol over COM port [UVC];
GenCP over virtual COM port enumerated over the USB interface [USB]		 via SAMTEC ST5 connector [16bit DV];
I2C (or via SAMTEC ST5 connector on Dione 640) [MIPI CSI-2];
GenCP protocol over COM port [UVC];
GenCP over virtual COM port enumerated over the USB interface [USB]
Digital output format 16bit DV, MIPI-CSI-2, UVC, USB 16bit DV, MIPI-CSI-2, UVC, USB
Trigger via SAMTEC ST5 connector (16bit DV);
NA (UVC, USB, MIPI CSI-2)		 via SAMTEC ST5 connector (16bit DV);
NA (UVC, USB, MIPI CSI-2)
Dione 1024 OEM series thermal core

The Dione 1024 OEM series is based on an uncooled microbolometer detector with a 1024x768 pixel resolution and 12 µm pitch. The detector NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. All Dione 1024 versions benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and availability of multiple lenses adds flexibility for integration programs in the target markets like safety and security, transportation and industrial process monitoring.

  • State-of-the-art detector with 12 µm pixel pitch
  • Industry leading SWaP (Size, Weight and Power)
  • Frame rates up to 80 Hz
Specifications
Mechanical specifications
Mechanical specifications Dione 1024 OEM 40 mK Dione 1024 OEM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 35 x 35 x 21.5 35 x 35 x 21.5
Weight [gr] - excluding lens 25 25
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR SAMTEC ST5-30-1.50-L-D-P-TR
Environmental & Power specifications
Environmental & Power specifications Dione 1024 OEM 40 mK Dione 1024 OEM 50 mK
Ambient operating temperature range [°C] From -40 to +70 From -40 to +70
Storage temperature [°C] From -40 to +85 From -40 to +85
Average power consumption 1.9 W (at 30 Hz) & 2.1 W (at 60 Hz) 1.9 W (at 30 Hz) & 2.1 W (at 60 Hz)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 1024 OEM 40 mK Dione 1024 OEM 50 mK
Image format [pixels] 1024 x 768 1024 x 768
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 12.29 x 9.432 [15.49 diagonal] 12.29 x 9.432 [15.49 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8 - 14
Pixel operability >99.5% >99.5%
Max frame rate [full frame] [Hz] 80 80
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 16 16
Command and control SAMTEC ST5 connector SAMTEC ST5 connector
Digital output format 16 bit DV (standard), MIPI CSI-2 (optional) 16 bit DV (standard), MIPI CSI-2 (optional)
Trigger SAMTEC ST5 connector SAMTEC ST5 connector
Dione 1024 CAM series thermal core

The Dione 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core. It consists of 1024x768 pixel resolution and 12 µm pixel pitch. With maximum frame rate of 80 Hz and NETD of less than 40 mK (available based on request) or 50 mK, Dione 1024 CAM series is a LWIR uncooled thermal imaging SWaP module.

The housing of the camera supports M34/M45 lens (optional). The cameras offer advanced image processing with the use of Xenics image enhancement feature with low power consumption operation. Thanks to GenICam compliance and the availability of multiple lenses (optional), it provides a high level of tunability for Dione 1024 CAM series to be optimally integrated into various systems like defense, transportation and industrial process monitoring.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Shutterless and uncooled operation
Specifications
Mechanical specifications
Mechanical specifications Dione 1024 CAM 40 mK Dione 1024 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 40 x 40 x 34 or 50 x 50 x 35 40 x 40 x 34 or 50 x 50 x 35
Weight [gr] - excluding lens 78 or 80 78 or 80
Optical interface (optional) M34x0.5 or M45x0.75 M34x0.5 or M45x0.75
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR SAMTEC ST5-30-1.50-L-D-P-TR
Environmental & Power specifications
Environmental & Power specifications Dione 1024 CAM 40 mK Dione 1024 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 From -40 to +70
Storage temperature [°C] From -40 to +85 From -40 to +85
Average power consumption 1.9 W (at 30 Hz) & 2.1 W (at 60 Hz) 1.9 W (at 30 Hz) & 2.1 W (at 60 Hz)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 1024 CAM 40 mK Dione 1024 CAM 50 mK
Image format [pixels] 1024 x 768 1024 x 768
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 12.29 x 9.432 [15.49 diagonal] 12.29 x 9.432 [15.49 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8 - 14
Pixel operability >99.5% >99.5%
Max frame rate [full frame] [Hz] 80 80
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 16 16
Command and control SAMTEC ST5 connector SAMTEC ST5 connector
Digital output format 16bit DV 16bit DV
Trigger SAMTEC ST5 connector SAMTEC ST5 connector
Dione 1280 OEM series thermal core

Based on an uncooled microbolometer detector, the Dione 1280 OEM series is with 1280x1024 pixel resolution and 12 µm pixel pitch. The maximum frame rate is 60 Hz and the detector NETD is offered with less than 40 mK (based on request) or 50 mK. The Dione 1280 OEM series provides advanced image processing capability with the use of Xenics image enhancement feature in a low power consumption operation.

In addition, the GenICam compliance and the availability of multiple lenses add flexibility for integration programs in markets like safety and security, transportation and industrial process monitoring.

  • State-of-the-art detector with 12 µm pixel pitch
  • Industry leading SWaP (Size, Weight and Power)
  • Frame rates up to 60 Hz
Specifications
Mechanical specifications
Mechanical specifications Dione 1280 OEM 40 mK Dione 1280 OEM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 35 x 35 x 23.5 (16bit DV);
35 x 35 x 30 (MIPI CSI-2, USB)		 35 x 35 x 23.5 (16bit DV);
35 x 35 x 30 (MIPI CSI-2, USB)
Weight [gr] - excluding lens 27 (16bit DV); 30 (MIPI CSI-2, USB) 27 (16bit DV); 30 (MIPI CSI-2, USB)
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV]; 22-pin FFC/FPC connector (Molex) [MIPI CSI-2]; Type B USB 3.0 [USB] SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV]; 22-pin FFC/FPC connector (Molex) [MIPI CSI-2]; Type B USB 3.0 [USB]
Environmental & Power specifications
Environmental & Power specifications Dione 1280 OEM 40 mK Dione 1280 OEM 50 mK
Ambient operating temperature range [°C] From -40 to +70 (16bit DV, USB); From -30 to +70 (MIPI CSI-2) From -40 to +70 (16bit DV, USB); From -30 to +70 (MIPI CSI-2)
Storage temperature [°C] From -40 to +85 (16bit DV, USB); From -30 to +85 (MIPI CSI-2) From -40 to +85 (16bit DV, USB); From -30 to +85 (MIPI CSI-2)
Average power consumption [W] 1.9 (at 30 Hz operation - 16bit DV) & 2.1 (at 60 Hz operation - 16bit DV); < 2.7 (MIPI CSI-2, USB) 1.9 (at 30 Hz operation - 16bit DV) & 2.1 (at 60 Hz operation - 16bit DV); < 2.7 (MIPI CSI-2, USB)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 1280 OEM 40 mK Dione 1280 OEM 50 mK
Image format [pixels] 1280 x 1024 1280 x 1024
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 15.36 x 12.29 [19.67 diagonal] 15.36 x 12.29 [19.67 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8-14 8-14
Pixel operability >99.5% (excluding 3 peripheral rows and columns) >99.5% (excluding 3 peripheral rows and columns)
Max frame rate [full frame] [Hz] 60 (16bit DV, MIPI CSI-2); 40 (USB) 60 (16bit DV, MIPI CSI-2); 40 (USB)
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control via SAMTEC ST5 connector [16bit DV]; I2C [MIPI CSI-2]; GenCP over virtual COM port enumerated over the USB interface [USB] via SAMTEC ST5 connector [16bit DV]; I2C [MIPI CSI-2]; GenCP over virtual COM port enumerated over the USB interface [USB]
Digital output format 16bit DV, MIPI CSI-2, USB 16bit DV, MIPI CSI-2, USB
Trigger via SAMTEC ST5 connector (16bit DV); NA (MIPI CSI-2, USB) via SAMTEC ST5 connector (16bit DV); NA (MIPI CSI-2, USB)
Dione 1280 CAM series thermal core

The Dione 1280 CAM series is based on the thermal imaging core (Dione 1280 OEM) is with 1280 x 1024 pixels and 12 µm pixel pitch. With NETD less than 40 mK (available based on request) or 50 mK, the cameras also offer maximum frame of 60 Hz. The cameras are offered with SWaP (Size, Weight and Power) features and uses the Xenics image enhancement for advanced image processing with low power consumption operation.

A LWIR uncooled thermal imaging module, Dione 1280 CAM series is offered with housing supporting M34/M45 lens options. This ultra-compact camera series is designed for use in safety and security systems with industrial thermal imaging systems included.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Shutterless and uncooled operation
Specifications
Mechanical specifications
Mechanical specifications Dione 1280 CAM 40 mK Dione 1280 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 40 x 40 x 35 (M34 - 16bit DV); 50 x 50 x 36 (M45 - 16bit DV); 40 x 40 x 44.25 (M34 - MIPI CSI-2, USB); 50 x 50 x 45.25 (M45 - MIPI CSI-2, USB) 40 x 40 x 35 (M34 - 16bit DV); 50 x 50 x 36 (M45 - 16bit DV); 40 x 40 x 44.25 (M34 - MIPI CSI-2, USB); 50 x 50 x 45.25 (M45 - MIPI CSI-2, USB)
Weight [gr] - excluding lens 78 (M34 - 16bit DV);
80 (M45 - 16bit DV);
89 (M34 - MIPI CSI-2);
91 (M45 - MIPI CSI-2);
88 (M34 - USB);
90 (M45 - USB)		 78 (M34 - 16bit DV);
80 (M45 - 16bit DV);
89 (M34 - MIPI CSI-2);
91 (M45 - MIPI CSI-2);
88 (M34 - USB);
90 (M45 - USB)
Optical interface M34x0.5 or M45x0.75 M34x0.5 or M45x0.75
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV];
22-pin FFC/FPC connector (Molex) [MIPI CSI-2];
Type B USB 3.0 [USB]		 SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV];
22-pin FFC/FPC connector (Molex) [MIPI CSI-2];
Type B USB 3.0 [USB]
Environmental & Power specifications
Environmental & Power specifications Dione 1280 CAM 40 mK Dione 1280 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 (16bit DV, USB); From -30 to +70 (MIPI CSI-2) From -40 to +70 (16bit DV, USB); From -30 to +70 (MIPI CSI-2)
Storage temperature [°C] From -40 to +85 (16bit DV, USB); From -30 to +85 (MIPI CSI-2) From -40 to +85 (16bit DV, USB); From -30 to +85 (MIPI CSI-2)
Average power consumption 1.9 (at 30 Hz operation - 16bit DV); 2.1 (at 60 Hz operation - 16bit DV); < 2.7 (MIPI CSI-2, USB) 1.9 (at 30 Hz operation - 16bit DV); 2.1 (at 60 Hz operation - 16bit DV); < 2.7 (MIPI CSI-2, USB)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione 1280 CAM 40 mK Dione 1280 CAM 50 mK
Image format [pixels] 1280 x 1024 1280 x 1024
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 15.36 x 12.29 [19.67 diagonal] 15.36 x 12.29 [19.67 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8 -14 8-14
Pixel operability >99.5% (excluding 3 peripheral rows and columns) >99.5% (excluding 3 peripheral rows and columns)
Max frame rate [full frame] [Hz] 60 (16bit DV, MIPI CSI-2); 40 (USB) 60 (16bit DV, MIPI CSI-2); 40 (USB)
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control via SAMTEC ST5 connector [16bit DV]; I2C [MIPI CSI-2]; GenCP over virtual COM port enumerated over the USB interface [USB] via SAMTEC ST5 connector [16bit DV]; I2C [MIPI CSI-2]; GenCP over virtual COM port enumerated over the USB interface [USB]
Digital output format 16bit DV, MIPI CSI-2, USB 16bit DV, MIPI CSI-2, USB
Trigger via SAMTEC ST5 connector (16bit DV); NA (MIPI CSI-2, USB) via SAMTEC ST5 connector (16bit DV); NA (MIPI CSI-2, USB)
Dione S 640 CAM series thermal core

The Dione S 640 CAM series is based on an uncooled 12 µm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione S 640 versions are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Uncooled with mechanical shutter
Specifications
Mechanical specifications
Mechanical specifications Dione S 640 CAM 40 mK Dione S 640 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 37.4 x 37.4 x 28.4 (M24 - 16bit DV);
42 x 42 x 30.3 (M34 - 16bit DV);
37.5 x 37.5 x 32.25 (M24 - USB, MIPI CSI-2);
42 x 42 x 35.25 (M34 - USB, MIPI CSI-2)		 37.4 x 37.4 x 28.4 (M24 - 16bit DV);
42 x 42 x 30.3 (M34 - 16bit DV);
37.5 x 37.5 x 32.25 (M24 - USB, MIPI CSI-2);
42 x 42 x 35.25 (M34 - USB, MIPI CSI-2)
Weight [gr] - excluding lens 50 (M24 - 16bit DV);
55 (M34 - 16bit DV);
47 (M24 -MIPI CSI-2);
52 (M34 - MIPI CSI-2);
52 (M24 - USB);
58 (M34 - USB)		 50 (M24 - 16bit DV);
55 (M34 - 16bit DV);
47 (M24 -MIPI CSI-2);
52 (M34 - MIPI CSI-2);
52 (M24 - USB);
58 (M34 - USB)
Optical interface (optional) M24 or M34 x 0.5 M24 or M34 x 0.5
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV];
22-pin FFC/FPC connector (Molex) [MIPI CSI-2];
Type B USB 3.0 [USB]		 SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV];
22-pin FFC/FPC connector (Molex) [MIPI CSI-2];
Type B USB 3.0 [USB]
Environmental & Power specifications
Environmental & Power specifications Dione S 640 CAM 40 mK Dione S 640 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 (16bit DV, USB);
From -30 to +70 (MIPI CSI-2)		 From -40 to +70 (16bit DV, USB);
From -30 to +70 (MIPI CSI-2)
Storage temperature [°C] From -45 to +85 (16bit DV);
From -40 to +85 (USB);
From -30 to +85 (MIPI CSI-2)		 From -45 to +85 (16bit DV);
From -40 to +85 (USB);
From -30 to +85 (MIPI CSI-2)
Power consumption [W] 0.800 (60 Hz operation; 16bitDV);
< 1.3 (USB);
<1.0 (MIPI CSI-2)		 0.800 (60 Hz operation; 16bitDV);
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione S 640 CAM 40 mK Dione S 640 CAM 50 mK
Image format [pixels] 640 x 480 640 x 480
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 7.68 x 5.76 [9.6 diagonal] 7.68 x 5.76 [9.6 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8 - 14
Pixel operability >99.5% (excluding 3 peripheral rows and columns) >99.5% (excluding 3 peripheral rows and columns)
Max frame rate [full frame] [Hz] 60 60
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control via SAMTEC ST5 connector [16bit DV];
I2C [MIPI CSI-2];
GenCP over virtual COM port enumerated over the USB interface [USB]		 via SAMTEC ST5 connector [16bit DV];
I2C [MIPI CSI-2];
GenCP over virtual COM port enumerated over the USB interface [USB]
Digital output format 16bit DV, MIPI-CSI-2, USB 16bit DV, MIPI-CSI-2, USB
Trigger via SAMTEC ST5 connector (16bit DV);
NA (USB, MIPI CSI-2)		 via SAMTEC ST5 connector (16bit DV);
NA (USB, MIPI CSI-2)
Dione S 1024 CAM series thermal core

The Dione S 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core with 1024×768 pixels and 12 µm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. Dione S 1024 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M34/M45 lens (optional). Dione S 1024 CAM series benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and the availability of multiple lenses provide a high level of tunability for optimal integration into many systems. The compact Dione S 1024 CAM series find applications in safety and security, transportation and industrial process monitoring.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Uncooled with mechanical shutter
Specifications
Mechanical specifications
Mechanical specifications Dione S 1024 CAM 40 mK Dione S 1024 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 60 x 55 x 39 or 65 x 62 x 40 60 x 55 x 39 or 65 x 62 x 40
Weight [gr] - excluding lens 188 or 190 188 or 190
Optical interface (optional) M34x0.5 or M45x0.75 M34x0.5 or M45x0.75
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR SAMTEC ST5-30-1.50-L-D-P-TR
Environmental & Power specifications
Environmental & Power specifications Dione S 1024 CAM 40 mK Dione S 1024 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 From -40 to +70
Storage temperature [°C] From -40 to +85 From -40 to +85
Average power consumption 2.3 W (at 60 Hz) 2.3 W (at 60 Hz)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione S 1024 CAM 40 mK Dione S 1024 CAM 50 mK
Image format [pixels] 1024 x 768 1024 x 768
Pixel pitch [µm] 12 12
Detector type Microbolometer Microbolometer
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 12.29 x 9.432 [15.49 diagonal] 12.29 x 9.432 [15.49 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8-14 8-14
Pixel operability >99.5% >99.5%
Max frame rate [full frame] [Hz] 80 80
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control SAMTEC ST5 connector SAMTEC ST5 connector
Digital output format 16bit DV 16bit DV
Trigger SAMTEC ST5 connector SAMTEC ST5 connector
Dione S 1280 CAM series thermal core

The Dione S 1280 CAM series with 1280 x 1024 resolution is based on an uncooled 12 µm pitch microbolometer detector. The NETD is of less than 40 mK (availability upon request) and 50 mK. Dione S 1280 CAM series consists of camera cores optimized for low SWaP (Size, Weight and Power) is available with mechanical shutter operation.

While keeping power consumption low, the camera utilizes Xenics image enhancement for advanced image processing. Dione S 1280 CAM series is a LWIR uncooled thermal imaging SWaP module with housing supporting the optional M34/M45 lenses. With its ultra-compactness and GenICam compliant feature, Dione S 1280 CAM series are suitable for safety and security systems as well as industrial thermal imaging systems.

  • State-of-the-art detector with 12 µm pitch
  • Industry leading SWaP (Size, Weight and Power) module
  • Uncooled with mechanical shutter
Specifications
Mechanical specifications
Mechanical specifications Dione S 1280 CAM 40 mK Dione S 1280 CAM 50 mK
Approximate dimensions - excluding lens [width x height x length] [mm] 60 x 55 x 39 (M34 - 16bit DV);
65 x 62 x 40 (M45 - 16bit DV);
60 x 55 x 43.25 (M34 - MIPI CSI-2, USB);
65 x 62 x 44.25 (M45 - USB);
60 x 60 x 40 (M45 - MIPI CSI-2)		 60 x 55 x 39 (M34 - 16bit DV);
65 x 62 x 40 (M45 - 16bit DV);
60 x 55 x 43.25 (M34 - MIPI CSI-2, USB);
65 x 62 x 44.25 (M45 - USB);
60 x 60 x 40 (M45 - MIPI CSI-2)
Weight [gr] - excluding lens 188 (M34 - 16bit DV);
190 (M45 - 16bit DV);
192 (M34 - MIPI CSI-2);
209 (M45 - MIPI CSI-2);
209 (M34 - USB);
211 (M45 USB)		 188 (M34 - 16bit DV);
190 (M45 - 16bit DV);
192 (M34 - MIPI CSI-2);
209 (M45 - MIPI CSI-2);
209 (M34 - USB);
211 (M45 USB)
Optical interface (optional) M34x0.5 or M45x0.75 M34x0.5 or M45x0.75
Connector general I/O SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV];
22-pin FFC/FPC connector (Molex) [MIPI CSI-2];
Type B USB 3.0 [USB]		 SAMTEC ST5-30-1.50-L-D-P-TR [16bit DV];
22-pin FFC/FPC connector (Molex) [MIPI CSI-2];
Type B USB 3.0 [USB]
Environmental & Power specifications
Environmental & Power specifications Dione S 1280 CAM 40 mK Dione S 1280 CAM 50 mK
Ambient operating temperature range [°C] From -40 to +70 (16bit DV, USB);
From -30 to +70 (MIPI CSI-2)		 From -40 to +70 (16bit DV, USB);
From -30 to +70 (MIPI CSI-2)
Storage temperature [°C] From -40 to +85 (16bit DV, USB);
From -30 to +85 (MIPI CSI-2)		 From -40 to +85 (16bit DV, USB);
From -30 to +85 (MIPI CSI-2)
Power consumption [W] 2.3 (at 60 Hz operation; 16bitDV);
<2.6 (MIPI CSI-2); < 2.7 (USB)		 2.3 (at 60 Hz operation; 16bitDV);
<2.6 (MIPI CSI-2); < 2.7 (USB)
Power supply voltage DC 5 V DC 5 V
Shock 40 g, 11 ms, MIL-STD810G 40 g, 11 ms, MIL-STD810G
Vibration 5 g [20 to 2000 Hz], MIL-STD810G 5 g [20 to 2000 Hz], MIL-STD810G
Regulatory compliance RoHS RoHS
Electro-optical specifications
Electro-optical specifications Dione S 1280 CAM 40 mK Dione S 1280 CAM 50 mK
Image format [pixels] 1280 x 1024 1280 x 1024
Pixel pitch [µm] 12 12
Integration type Rolling shutter Rolling shutter
Active area and diagonal [mm] 15.36 x 12.29 [19.67 diagonal] 15.36 x 12.29 [19.67 diagonal]
Detector NETD [Noise Equivalent Temperature Difference] [mK] <40 [at 30 Hz, 300K, F/1], available upon request <50 [at 30 Hz, 300K, F/1]
Spectral range [µm] 8 - 14 8 - 14
Pixel operability >99.5% (excluding 3 peripheral rows and columns) >99.5% (excluding 3 peripheral rows and columns)
Max frame rate [full frame] [Hz] 60 (16bit DV, MIPI CSI-2); 40 (USB) 60 (16bit DV, MIPI CSI-2); 40 (USB)
Integration time range [µs] 20 - 65 20 - 65
Analog-to-Digital [ADC] [bits] 14 14
Command and control via SAMTEC ST5 connector [16bit DV];
I2C [MIPI CSI-2];
GenCP over virtual COM port enumerated over the USB interface [USB]		 via SAMTEC ST5 connector [16bit DV];
I2C [MIPI CSI-2];
GenCP over virtual COM port enumerated over the USB interface [USB]
Digital output format 16bit DV, MIPI CSI-2, USB 16bit DV, MIPI CSI-2, USB
Trigger via SAMTEC ST5 connector (16bit DV);
NA (MIPI CSI-2, USB)		 via SAMTEC ST5 connector (16bit DV);
NA (MIPI CSI-2, USB)
Dione XP 640 CAM series thermal core

The Dione XP (Extreme Performance) 640 CAM series is a high-performance LWIR uncooled thermal imaging solution, delivering 640x480 resolution with a 12µm pixel pitch and NETD down to <35mK or <40 mK. Optimized for demanding defense use, it features advanced XLIE (Xenics Local Image Enhancement) algorithms for exceptional dynamic range and image contrast. Housed for M24/M34 lenses, it ensures stable imaging across wide temperature ranges with automatic calpack selection.

With ultra-low latency (<100µs), fast time to first image, and contour mode, it simplifies fusion and enhances detection. Local AGC and advanced image processing improve scene dynamics and clarity, while its compact SWaP design and versatile interface options enable seamless integration.

  • Fast time to first corrected image
  • Enhanced detection: contour mode for clear target visibility
  • Embedded optimized local contrast enhancement
  • Stable imaging: auto calpacks adapts to temperature changes
Specifications
Camera Specifications Dione XP CAM
Pixel pitch 12 µm
Image format 640 x 480 pixels
Spectral range 8 - 14 µm
Max frame rate (full frame) 60 Hz
Regulatory compliance RoHS
Integration type Rolling shutter
Power consumption 0.750 W (16bit DV); < 1.1 W (MIPI CSI-2); <1.32 W (UVC); < 1.3 W (USB)
Optical interface (optional) M24 or M34 x0.5
Detector NETD < 40 mK;
<35 mK
Digital output format 16 bit DV, MIPI CSI-2, USB, UVC
Dione XP S 640 CAM series thermal core

The Dione XP (Extreme Performance) S 640 CAM series is a high-performance LWIR uncooled thermal imaging core featuring a 640x480 microbolometer with 12 µm pixel pitch, offering NETD <35 mK or <40 mK. Designed for M24/M34 lenses, it delivers sharp imaging via XLIE (Xenics Local Image Enhancement) algorithms, local AGC, and contour mode.

With fast start-up, <100 µs latency, auto calpack switching, and GenICam compliance, it ensures seamless integration and reliable performance in harsh environments.

  • Fast time to first corrected image
  • Enhanced detection: contour mode for clear target visibility
  • Embedded optimized local contrast enhancement
  • Stable imaging: auto calpacks adapts to temperature changes
  • Uncooled with mechanical shutter
Specifications
Camera Specifications Dione XP S CAM
Pixel pitch 12 µm
Image format 640 x 480 pixels
Spectral range 8 - 14 µm
Max frame rate (full frame) 60 Hz
Regulatory compliance RoHS
Integration type Rolling shutter
Power consumption 0.800 W (16bitDV);
< 1.3 W (USB);
<1.0 W (MIPI CSI-2)
Optical interface (optional) M24 or M34 x0.5
Detector NETD < 40 mK;
<35 mK
Digital output format 16 bit DV, MIPI CSI-2, USB

Product Selector Guide

Part number Description
XEN-000791Dione 320 OEM 40 mK
XEN-000789Dione 320 OEM 50 mK
XEN-000792Dione 320 CAM 40 mK
XEN-000790Dione 320 CAM 50 mK
XEN-000734Dione 640 OEM 40 mK
XEN-000733Dione 640 OEM 50 mK
XEN-000696Dione 640 CAM 50 mK
XEN-000697Dione 640 CAM 40 mK
XEN-000714Dione S 640 CAM 40 mK
XEN-000713Dione S 640 CAM 50 mK
XEN-000793Dione 1024 OEM 50 mK
XEN-000795Dione 1024 OEM 40 mK
XEN-000794Dione 1024 CAM 50 mK
XEN-000796Dione 1024 CAM 40 mK
XEN-000798Dione S 1024 CAM 40 mK
XEN-000797Dione S 1024 CAM 50 mK
XEN-000692Dione 1280 OEM 40 mK
XEN-000691Dione 1280 OEM 50 mK
XEN-000702Dione 1280 CAM 40 mK
XEN-000701Dione 1280 CAM 50 mK
XEN-000736Dione S 1280 CAM 40 mK
XEN-000735Dione S 1280 CAM 50 mK
XEN-001001Dione XP 640 OEM 40 mK
XEN-001003Dione XP 640 CAM 40 mK
XEN-001000Dione XP 640 OEM 35 mK
XEN-001002Dione XP 640 CAM 35 mK
XEN-001005Dione XP S 640 CAM 40 mK
XEN-001004Dione XP S 640 CAM 35 mK

Brochure/Leaflet

Dione 1024 CAM Series Dione 1024 OEM Series Dione 1280 CAM Series Dione 1280 OEM Series Dione 320 CAM Series Dione 320 OEM Series Dione 640 CAM Series Dione 640 OEM Series Dione S 1024 CAM Series Dione S 1280 CAM Series Dione S 640 CAM Series Dione XP 640 CAM Series Dione XP OEM Series Dione XP 640 CAM Series
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